Abstracts for SM-03 can now be submitted

[Vadim Shapiro]

Dear Colleagues,

Abstracts for 2003 SOLID MODELING SYMPOSIUM can now be submitted
via the symposium webpage at
http://maximus.ce.washington.edu/sm03/

The deadline for abstract submission is October 15, 2002, with
full papers due on November 30, 2002

Gershon Elber,  Technion, Israel
Vadim Shapiro,  University of Wisconsin, USA
Program Co-Chairs,  ACM Solid Modeling 2003

-------------------------------------------------------------------------------------

                            Call for Papers

                          SOLID MODELING 2003

        Eighth ACM Symposium on Solid Modeling and Applications

        University of Washington, Seattle, WA  June 16-20, 2003

	              Sponsored by ACM SIGGRAPH

The Solid Modeling  symposia series is an international  forum for the
exchange of recent research and applications of solid modelling, shape
modelling,   and  geometric  computation   in  design,   analysis  and
manufacturing, as well as  in the emerging biomedical, geophysical and
other  areas. This highly  successful symposium,  which has  been held
bi-annually  since 1991,  brings together  prominent  researchers, key
practitioners, and  numerous students in the field.   The symposium is
held  annually, alternating  its location  between the  USA  and other
countries.

The  Solid Modeling  2003  symposium will  be  held on  the campus  of
University  of  Washington  in  Seattle,  WA,  USA.   In  addition  to
technical papers  in plenary sessions, the program  for Solid Modeling
2003 will include:

    * academic and industrial tutorials
    * keynote lectures
    * panel and poster sessions
    * best paper award at the symposium banquet
    * sponsorship of students to attend the symposium
    * social program

More information on  the symposium can be found  on the Solid Modeling
2003 web page:

      http://www.ce.washington.edu/sm03

The papers submission schedule is as follows:

October 15, 2002:     Abstracts due
November 30, 2002:    Full papers due
February 10, 2003:    Notice of acceptance and reviews
March 31, 2003:       Final camera-ready papers and extended abstracts
		      due

For details on how to  submit abstracts and papers, please consult the
web page http://www.ce.washington.edu/sm03/submit_proc.

Abstracts  are used  to facilitate  the review  process and  should be
150-300 words  in length.  Papers are limited  to 12 typeset  pages in
length,   including  figures  and   references,  and   should  present
previously   unpublished  original   results.  All   papers   will  be
peer-reviewed  and  can be  selected  for  presentation  at a  plenary
session, or for presentation at  a poster session, with publication in
the conference  proceedings published by ACM Press.  A revised version
of selected papers will also be published in special issues of related
scientific journals.  Best  paper award will be selected  by a jury of
experts and will be presented at the symposium banquet.

Symposium Co-Chairs:

Pere Brunet,  Polytechnical University of Catalonia, Barcelona, Spain
George Turkiyyah,  University of Washington, USA


Program Co-Chairs:

Gershon Elber,  Technion, Israel
Vadim Shapiro,  University of Wisconsin, USA


Industrial Chair:

Jan Vandenbrande,  Boeing


Topics  of interest  for  Solid  Modeling 2003  include,  but are  not
limited to:

Geometric and topological representations
Multi-resolution models
Heterogeneous models
Geometric interrogations and reasoning
Computational geometry
Robustness of geometric computations
Blends, sweeps, offsets & deformations
Procedural, constraint-based and parametric modeling
Feature-based modeling
Conceptual design techniques
Product and assembly modeling
Representation conversion
Product data exchange
User interaction techniques
Haptic interfaces
Collaborative/distributed design
Virtual environments and prototypes
Reverse engineering
Engineering analysis using solid models
Engineering tolerances
Manufacturing and assembly planning
Computational support for new manufacturing technologies
Biomedical applications
Geo-scientific applications
Entertainment applications 


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