SM-03 -- Registration and Final Program

Vadim Shapiro vshapiro at engr.wisc.edu
Fri May 16 18:47:22 PDT 2003


Dear Colleague,

Registration is now open at http://www.ce.washington.edu/sm03/
for the 8th ACM Symposium for Solid Modeling and Applications that
will take place in Seattle, WA on June 16-20, 2003.

Please join us for a three-day technical program, 2 days of tutorials,
industry presentations and a tour of the Boeing 777 final assembly plant.
The details are posted at the  conference website
http://www.ce.washington.edu/sm03/

Symposium Co-Chairs:
George Turkiyyah,  University of Washington, USA
Pere Brunet,  Polytechnical University of Catalonia, Barcelona, Spain

Program Co-Chairs:
Gershon Elber,  Technion, Israel
Vadim Shapiro,  University of Wisconsin, USA

Industrial Chair:
Jan Vandenbrande,  Boeing


-------------
The compgeom mailing lists: see
http://netlib.bell-labs.com/netlib/compgeom/readme.html
or send mail to compgeom-request at research.bell-labs.com with the line:
send readme
Now archived at http://www.uiuc.edu/~sariel/CG/compgeom/maillist.html.



More information about the Compgeom-announce mailing list