CFP: Solid Modeling'99

Joseph S. B. Mitchell jsbm at
Sun Jul 5 09:31:32 PDT 1998

Please note that Solid Modeling'99 and the SoCG'99
have been scheduled next year in order not to overlap;
in fact, we want to encourage computational geometry
participation in the Solid Modeling conference!

   SoCG'99:  June 13-16, 1999   (Miami)
   Solid Modeling'99:  June 9-11, 1999  (Ann Arbor)


Joe Mitchell


                        *  CALL FOR PAPERS  *

              *                                       *
              *          SOLID MODELING '99           *
              *                                       *
              *         FIFTH ACM SYMPOSIUM ON        *
              *                                       *

           Sheraton Inn, Ann Arbor, Michigan, June 9-11, 1999

                     Sponsored by ACM SIGGRAPH

This symposium provides an international forum for the exchange of recent
research and practical results in all areas and applications of solid
modeling. Emphasis is on solid modeling in design, analysis and
manufacturing. Previous symposia in this series (Austin, Texas, 1991,
Montreal, Canada, 1993, Salt Lake City, Utah, 1995, and Atlanta, Georgia,
1997) brought together the most prominent researchers, key practitioners,
and numerous students in the field.

In 1999, the symposium will have several new features, including:
  * tutorials on June 8
  * panel sessions
  * ACIS Best Paper Award, sponsored by Spatial Technology Inc.
  * sponsorship by ONR of undergraduate students to attend the symposium.

More information on the symposium, as it becomes available, can be found on
the Solid Modeling '99 WWW page at:

If you do not have access to the WWW, you can request a copy of this page
by sending an email to dutta at

The schedule for submission of papers is as follows:

September 30, 1998:   Abstracts due
October   30, 1998:   Full papers due
January   31, 1999:   Notice of acceptance and reviewers' comments
February  28, 1999:   Final camera-ready papers and extended abstracts due

For details on how to submit abstracts and papers, please consult the WWW 

Abstracts are used to facilitate the review process, and should be 150-300
words long.

Papers should be at most 12 normally typeset pages, including figures and
references, and should present previously unpublished original results.

Papers will be peer-reviewed and can be selected for presentation at a
plenary session with publication in the conference proceedings published by
ACM Press, or presentation at a poster session with publication of an
extended two-page abstract in the conference proceedings.

A revised version of a number of selected papers will also be published in
a special issue of the journal Computer-Aided Design.

The ACIS Best Paper Award of $1500, sponsored by Spatial Technology Inc.,
will be awarded by a jury.

Video and other special equipment will be available for presentations when

Topics for papers include, but are not limited to:

 1) Geometric and topological representations
 2) Multiresolution models
 3) Heterogeneous models
 4) Geometric interrogations and reasoning
 5) Computational geometry relevant to modeling
 6) Robustness of geometric computations
 7) Blends, sweeps, offsets, deformations and other constructional methods
 8) Procedural, constraint-based and parametric modeling
 9) Modeling families of geometric objects
10) Feature-based modeling
11) Conceptual design techniques
12) Product modeling
13) Assembly modeling
14) Representation conversion
15) Product data exchange
16) User interaction techniques
17) Collaborative/distributed design
18) Virtual environments and prototypes
19) Reverse engineering
20) Engineering analysis, including FE mesh generation
21) Engineering tolerances
22) Manufacturing and assembly planning
23) Computational support for new manufacturing technologies

General Chair
  Deba Dutta, University of Michigan

Financial Chair
  Ming Lin, University of North Carolina

Program Co-Chairs
  Wim Bronsvoort, Delft University of Technology
  David Anderson, Purdue University

Program Committee
  Adrian Bowyer, University of Bath
  Beat Bruderlin, Technical University of Ilmenau
  Pere Brunet, Polytechnic University of Catalonia
  Richard Crawford, University of Texas
  Gershon Elber, Technion
  Bianca Falcidieno, CNR Italy
  Mark Henderson, Arizona State University
  Chris Hoffmann, Purdue University
  Fumihiko Kimura, University of Tokyo
  R\"udiger Klein, Daimler Benz
  Kunwoo Lee, Seoul National University
  Remi Lequette, ILOG
  Dinesh Manocha, University of North Carolina
  Martti M\"antyl\"a, Helsinki University of Technology
  Jai Menon, IBM Research
  Jim Miller, University of Kansas
  Joseph Mitchell, SUNY Stony Brook
  Nick Patrikalakis, MIT
  Mike Pratt, Rensselaer/NIST
  Ari Rappoport, Hebrew University
  Jarek Rossignac, Georgia Institute of Technology
  Vadim Shapiro, University of Wisconsin-Madison
  George Turkiyyah, University of Washington
  Tamas Varady, Hungarian Academy of Sciences
  Kevin Weiler, Autodesk
  John Woodwark, Information Geometers

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